Annealing Treatment Promotes Micro-adhesion Of Copper Terminal Block Contact Surfaces.

After annealing, the internal structure of copper terminal block undergoes significant changes. Under heat treatment conditions, the internal grains recrystallize and grain boundary migration occurs. This process reduces lattice dislocations remaining from cold working, making the metal structure more flexible and ductile. This material state makes it easier for copper distribution block to form a tight fit when bonded to contacts, improving overall contact consistency.

Annealing has a direct impact on the microstructure of copper terminal strip. The annealing process alters the grain size and distribution through heating and controlled cooling cycles. Refining the grains helps to distribute stress more evenly during material deformation, thereby forming a more regular and continuous micro-adhesion area at the contact interface. Grain refinement also reduces the local deformation differences caused by coarse and uneven grains under loading, supporting the overall mating effect of the contact surfaces.