How Does Heat Treatment Improve The Contact Performance Of Copper Terminal Blocks?

During the high-temperature annealing stage, grain boundary migration and grain recrystallization transform copper from a hardened state to a softened state, resulting in a more uniform conductive path. This is crucial for the contact resistance performance of copper terminal block. copper distribution block inherently possesses extremely low resistivity, and its conductivity is significantly affected by grain refinement and defect reduction; annealing is a controllable way to achieve this microscopic improvement.

Adjusting the internal structure of copper terminal strip through heat treatment promotes smoother electron flow at the contact interface, helping to reduce the additional resistance caused by microscopic discontinuities.