Improve The Consistency Of Copper Terminal Block Annealing Process

The annealing process for copper terminal block involves applying controlled heat treatment to copper to induce recrystallization changes in the metal's internal structure, thereby improving its microstructure.

During the annealing process, the settings of temperature, time, and cooling profiles directly influence the micrograin evolution of copper distribution block. Heating within a specific temperature range and maintaining an appropriate residence time can significantly alter the grain boundary state of copper. This grain boundary optimization is a crucial factor in improving overall service consistency.

At the manufacturing execution level, a well-planned annealing furnace layout and strict control of the furnace temperature distribution help ensure that all batches of copper terminal strip achieve similar microstructures after heat treatment. This process consistency is closely related to mechanical property consistency and plays a vital role in the quality management system for mass production.