Introduction To The Function Of Silver Plating On The Surface Of Push-in Terminals

The push in terminal block body is typically made of copper or a copper alloy. By electroplating a layer of silver on the surface, the contact performance and conductivity stability of push in din rail terminal blocks can be significantly improved in actual use. Silver has a higher electrical conductivity than copper, which results in lower contact resistance when push fit din rail terminals is in contact, which is beneficial for efficient current conduction.

The silver plating layer provides strong resistance to oxidation and corrosion. Bare copper terminals easily react with oxygen in air or humid environments to form an oxide layer. This oxide film has poor conductivity, increases contact resistance, and affects overall electrical performance. In contrast, the sulfide or oxide layer formed on the silver surface has better conductivity and can maintain a stable connection over a long period.

For power distribution or control systems that may handle large current flows or have strict requirements for temperature rise, silver-plated terminals perform better in terms of heat conduction and heat dissipation. Silver not only has excellent conductivity, but its thermal conductivity also helps reduce temperature rise, thereby improving system safety and reliability.