Metallurgical Bonding Mechanism Of Cold-pressed Pins In Crimping Process

The crimping process relies on a special mold to apply mechanical force to the contact socket crimp sleeve, causing the conductor to undergo plastic deformation. The oxide film on the conductor surface breaks down with the metal flow, exposing the pure metal substrate. Simultaneously, the serrated edges of the crimp contact female inner wall tightly engage with the conductor, forming a molecular-level metal contact under pressure. This heat-free solid-state connection method can achieve welding-like strength when crimping parameters are appropriate.

The contact pressure between the conductor and the crimp contact male sleeve needs to be maintained within a specific range. Insufficient pressure results in incomplete oxide film breakage, limited pure metal contact area, and high contact resistance. In the automotive wiring harness industry, industry standards require a compression ratio controlled between 80% and 90%. Over-crimping can lead to conductor damage, while under-crimping creates air gaps at the connection interface.