The Cold-pressed Solder Wire Forms A Continuous Metal Structure With The Metal Surface Being Soldered.

In the crimp contact welding process, the solder wire is pressed into the surface of the metal being welded. Through plastic deformation, it creates high-pressure contact with the metal surface, significantly shortening the interatomic distance between the two. This method differs from traditional fusion welding, which relies on pressure to force a solid-state bond between the solder wire and the base material surface, rather than high-temperature melting. Cold pressure welding is a solid-state welding method that allows crimp contact pin to achieve a stable bond at room temperature or below the metal recrystallization temperature.

Within the contact area, the plastic deformation of the solder wire and the base material causes a rearrangement of the metal lattice, forming a so-called "bonding layer." This bonding layer means that the relationship between the solder wire and the base metal is no longer a simple physical bond, but a continuous metal structure in a metallurgical sense. Such a structure has good electrical conductivity and mechanical continuity, providing a stable metal connection even without melting or the addition of additional materials.