The Tricks Of Copper Terminal Blocks: Claiming To Be "tin-plated," But Actually "tin-sprayed/fake Plating."

In product descriptions for copper terminal block, some suppliers claim the surface has undergone "tin plating," leading customers to believe it's electroplating. However, another surface treatment method exists in the market called "plated tin," which differs significantly from genuine tin plating in both process and performance.

Plated tin does not involve metal deposition; instead, tin powder or particles are sprayed onto the copper distribution block surface. Its adhesion process differs from genuine plating, resulting in a significant difference in microstructure compared to electroplating. In practical applications, the protective effect of plated tin on the copper substrate and its subsequent processing performance are inferior to standard electroplated tin.

In the electronic interconnect market, the surface treatment of copper terminal strip directly affects the long-term stability and electrical contact of components. Compared to directly exposed copper, a tin layer can inhibit oxide growth to some extent, which is one of the important reasons why the industry performs surface treatment on copper surfaces.