Cold-pressed Pins, Used For Long-term Connections, May Experience Intermittent Connections.

As the equipment operates for an extended period, the mating area of ​​contact socket crimp is subjected to environmental temperature cycles, load changes, and microscopic material deformation, causing the elastic deformation of the metal to gradually transition to plastic deformation. This evolution of the microstructure directly affects the maintenance of contact pressure and resistance, causing gaps, micro-air gaps, and even changes in surface morphology to gradually appear in the originally tight contact area of crimp contact female, resulting in unstable resistance changes at the electrical contact point.

The numerous connection points in a printed circuit board mean that improper fit or uneven force distribution between any pinhole and crimp contact male can lead to localized contact degradation. Especially during manufacturing, errors in hole diameter and crimp socket contact dimensions, insufficient or excessive insertion pressure can reduce the microscopic bonding between the contact surfaces. This inadequate bonding is more likely to manifest as a loose connection after prolonged use.