Copper Terminal Blocks: Weaknesses Exist In Production Quality Supervision.
On the copper terminal block production line, many problems stem from improper treatment of the solder wire and the surfaces being soldered, resulting in reduced solder strength and poor electrical contact performance.
When an oxide film is present on the solder wire surface, the molten solder cannot adequately wet the copper distribution block surface during soldering, easily leading to cold solder joints or incomplete soldering. If the surfaces being soldered are not thoroughly cleaned before assembly, contaminants or residues will remain. These impurities affect the metallic bonding between the solder wire and copper, leading to increased contact resistance and fluctuations in conductivity.
In the mass production of copper terminal strip soldering, if the quality control of the solder wire is inadequate—such as uneven solder particle distribution, fluctuations in solder melting temperature or melting environment—or the oxide layer on the copper surface being soldered is not completely removed, voids or uneven intermetallic compound layers will form within the solder joint structure. Such solder joints will exhibit reduced mechanical strength and electrical stability.
