Press-type Terminal Connectors Rely On The Solder Wire And Solder Surface For Signal Transmission.

The conduction path of push wire terminal block is determined by the contact between the terminal metal and the pad/hole wall. Poor contact between the solder wire (or tin plating) and the surface metal being soldered can lead to high resistance, signal distortion, or unstable communication.

Proper tin plating or tin-plated vias provide a uniform, continuous metal interface for conductive contacts. A properly treated tin layer forms a stable contact surface with the terminal body, reducing contact resistance and minimizing the risk of impedance fluctuations due to oxidation or solder joint defects.

During the assembly stage of push in terminal block wire connector, if the solder/tin plating surface is clean, smooth, and free of impurities, the terminal and PCB hole undergo subtle plastic deformation after pressing, creating a tight metal interface. This metal-to-metal contact maintains low resistance and a clean signal path.

Compared to traditional soldering methods, push in wire terminal block eliminates the melting and heating process, preventing solder joint cracking or solder fatigue caused by high temperatures. During the connection process, a strong bond is formed between the terminal and the tin-plated socket through a cold-weld mechanism. This bonding method is particularly friendly to signal stability because the metal interface remains continuous, making it less prone to solder joint defects or poor contact.