Push-in Terminal Block Materials And Perforation Reflow Process

push in terminal block uses liquid crystal polymer (LCP) as the insulating material, which can withstand high-temperature welding environments. The high melting point of liquid crystal polymers makes push in din rail terminal blocks a suitable material choice for applications in perforated reflow technology.

The push fit din rail terminals's design must be matched with the thermal profile of the through-hole reflow process so that it can be soldered to surface mount (SMT) components simultaneously in a single reflow soldering process. The thermal properties of liquid crystal polymers allow push fit terminal block to maintain dimensional stability and structural integrity at reflow temperatures, which is beneficial for overall assembly consistency.