Why Does The Mechanical Strength Of Copper Terminal Blocks Decrease After Annealing?

After undergoing high-temperature annealing, recrystallization and grain growth occur inside the copper terminal block material, significantly reducing the dislocation density originally introduced by cold working. This will directly lead to a significant decrease in the material's hardness and tensile strength.

The reshaping of the internal microstructure is the primary cause of the reduced mechanical strength. During annealing, grain boundary migration and dislocation reduction cause the material to change from a strengthened state to a softened state. This softening phenomenon can occur in soft conductor materials such as copper distribution block. Mechanical properties such as tensile strength, yield strength and hardness usually show a downward trend after annealing, which is closely related to the reduction of dislocation resistance in the material structure.

For complex connection components such as copper terminal strip, durability and mechanical integrity are not only determined by the properties of the material itself, but also closely related to the annealing temperature and dwell time. Excessively high annealing temperatures or excessively long heat treatment processes accelerate grain growth and recrystallization, thereby significantly reducing the load-bearing capacity of the terminal block.